Works With: WXMPS MS

Weight: 295 g (indicated as product weight)

Mærkestrøm (80 °C): 130 A

Kontaktfladen er udført i CuZn med nikkeloverfladebehandling

Chip solder, 1,6 x 0,8 x 0,8, rulle med 9000 stk. SA819 Works With: WXMPS MSProduct Overview This solder preform from SENJU, referred to as Senju "Chip" preform (part number S M705 1608), is designed to reinforce areas where the amount of solder material is insufficient. The product's core function is to add extra solder material to local areas to improve the filling of the solder joint without altering the surrounding solder flow. Functional Features Designed to reinforce areas with insufficient solder volume. Unique